The electronics inside your phone, your car, and every satellite currently orbiting Earth share one critical weakness: heat. Push them past about 200 degrees Celsius and they start to fail. For decades, that thermal ceiling has been one of the hardest walls in engineering. Now a team at the University of Southern California may have just found a way around it.
In a study published in Science, researchers led by Joshua Yang, Arthur B. Freeman Chair Professor at the Ming Hsieh Department of Electrical and Computer Engineering of the USC Viterbi School of Engineering and the USC School of Advanced Computing, report a new type of electronic memory device that kept working reliably at 700 degrees Celsius, hotter than molten lava and far beyond anything previously achieved in its class. The device showed no signs of reaching its limit. Seven hundred degrees was simply as hot as their testing equipment could go.
“You may call it a revolution,” Yang said. “It is the best high-temperature memory ever demonstrated.”








