In this video I discuss 3D microchips which will keep Moore’s law going.
#3Dmicrochips.
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Superconductivity is the disappearance of electrical resistance in certain materials below a certain temperature, known as “transition temperature.” The phenomenon has tremendous implications for revolutionizing technology as know it, enabling low-loss power transmission and maintenance of electromagnetic force without electrical supply. However, superconductivity usually requires extremely low temperatures ~ 30 K (the temperature of liquid nitrogen, in comparison, is 77 K) and, therefore, expensive cooling technology. To have a shot at realizing a low-cost superconducting technology, superconductivity must be achieved at much higher transition temperatures.
Materials scientists have had a breakthrough on this front with crystalline materials containing hydrogen, known as “metal hydrides.” These are compounds formed by a metal atom bonded with hydrogen that have been predicted and realized as suitable candidates for achieving even room-temperature superconductivity. However, they require extremely high pressures to do so, limiting their practical applications.
In a new study published in Chemistry of Materials, a group of researchers led by Professor Ryo Maezono from Japan Advanced Institute of Science and Technology (JAIST) performed computer simulations to expand the search for high-temperature superconductors, looking for potential candidates among ternary hydrides (hydrogen combined with two other elements).
This design can either double the performance of chips or reduce power use by 85%.
In May of 2021, we brought you a breakthrough in semiconductor materials that saw the creation of a chip that could push back the “end” of Moore’s Law and further widen the capability gap between China and U.S.-adjacent efforts in the field of 1-nanometer chips.
The breakthrough was accomplished in a joint effort, involving the Massachusetts Institute of Technology (MIT), National Taiwan University (NTU), and the Taiwan Semiconductor Manufacturing Co (TSMC), which is the world’s largest contract manufacturer of advanced chips. At the core of the breakthrough was a process that employs semi-metal bismuth to allow for the manufacture of semiconductors below the 1-nanometer (nm) level.
Microsoft’s attempts to steer Windows users toward the Edge browser are attracting notice. Can the Third Browser War around the corner?
Users of Microsoft’s Windows 10 and 11 operating systems have recently reported seeing unusual prompts when they attempt to download Google’s Chrome browser to their device, according to The Verge.
If Microsoft is indeed launching a third Browser War, can the mid-1990s be far behind? Men, put on your flat-front chinos or straight-leg jeans, women, put on a mini-skirt and knee socks, pop a disc with “The Macarena” into your car’s sound system, and head for the mall. There, Toy Story or Braveheart is playing, and you can stop by Starbucks for their new frozen Frappuccino.
Continue reading “Is Microsoft Launching a New Browser War?” »
“The industry will see normalization and balance by the middle of 2022, with a potential for overcapacity in 2023 as larger scale capacity expansions begin to come online towards the end of 2022,” the research firm predicts.
Indeed, major semiconductor makers—including Intel, TSMC and Samsung—have all boosted investment in expanding chip capacity amid the current shortage. At the same time, the US government wants to spur more domestic chip manufacturing with billions in potential funding.
The big question is which sectors will see the semiconductor supplies improve to the point of overcapacity. Current shortage have ensnared a wide range of products, including PCs, graphics cards, video game consoles, in addition to cars, smartphones, and smart home devices.
A nervous excitement hangs in the air. Half a dozen scientists sit behind computer screens, flicking between panels as they make last-minute checks. “Go and make the gun dangerous,” one of them tells a technician, who slips into an adjacent chamber. A low beep sounds. “Ready,” says the person running the test. The control room falls silent. Then, boom.
Next door, 3 kilograms of gunpowder has compressed 1,500 liters of hydrogen to 10,000 times atmospheric pressure, launching a projectile down the 9-meter barrel of a two-stage light gas gun at a speed of 6.5 kilometers per second, about 10 times faster than a bullet from a rifle.
On the monitors the scientists are checking the next stage, when the projectile slams into the target—a small transparent block carefully designed to amplify the force of the collision. The projectile needs to hit its mark perfectly flush. The slightest rotation risks derailing the carefully calibrated physics.
James McKenzie is excited about the prospects of firms that are developing technology based on seemingly esoteric fundamental quantum phenomena.
Physicists have long boasted of their success in what’s known as “quantum 1.0” technology – semiconductor junctions, transistors, lasers and so on. Thanks to their efforts over the last 75 years, we have smart phones, computers, laptops and other quantum-enabled devices that have transformed our lives. But the future will increasingly depend on “quantum 2.0” technology, which taps into phenomena like superposition and entanglement to permit everything from quantum computing and cryptography to quantum sensing, timing and imaging.
The incredible possibilities of quantum 2.0 were brought home to me when I attended the UK’s National Quantum Technologies Showcase in central London last month. The event featured more than 60 exhibitors and I was amazed how far things have progressed. In fact, it coincided with two positive developments. One was an announcement by UK Research and Innovation (UKRI) of a further £50m to support quantum industrial projects. The other was the UK and US signing a joint “statement of intent” to boost collaboration on quantum science and technologies.
Over the past few years, different techniques have made it possible to improve the viewing angles of the cameras, taking advantage of extra functionalities such as lasers. This technology allows the device to track objects moving around corners, even when they are completely obscured from view. The device could be used for search-and-rescue missions or installed on cars to detect incoming vehicles.
Now, researchers at the Stanford Computational Imaging Lab have developed a novel method called non-line-of-sight imaging, or keyhole imaging, that allows you to scan an entire room by simply pointing a laser through the keyhole. A single point of laser light entering a room can be used to see what physical objects might be inside.
Continue reading “A laser shot through a keyhole can expose everything inside a closed room” »
China is now making every effort to gain silicon independence. According to the plan of the ruling party, by 2025 at least 70% of chips in Chinese products should be local production. A special role in achieving this goal is assigned to Semiconductor Manufacturing International Corp (SMIC), which is actively developing advanced technologies in the production of semiconductor products.
IBM and Samsung claim they’ve made a breakthrough in semiconductor design. On day one of the IEDM conference in San Francisco, the two companies unveiled a new design for stacking transistors vertically on a chip. With current processors and SoCs, transistors lie flat on the surface of the silicon, and then electric current flows from side-to-side. By contrast, Vertical Transport Field Effect Transistors (VTFET) sit perpendicular to one another and current flows vertically.
According to IBM and Samsung, this design has two advantages. First, it will allow them to bypass many performance limitations to extend Moore’s Law beyond the 1-nanometer threshold. More importantly, the design leads to less wasted energy thanks to greater current flow. They estimate VTFET will lead to processors that are twice as fast and use 85 percent less power than chips designed with FinFET transistors. IBM and Samsung claim the process may one day allow for phones that go a full week on a single charge. They say it could also make certain energy-intensive tasks, including cryptomining, more power-efficient and therefore less impactful on the environment.
IBM and Samsung haven’t said when they plan to commercialize the design. They’re not the only companies attempting to push beyond the 1-nanometer barrier., Intel said it aims to finalize the design for angstrom-scale chips by 2024. The company plans to accomplish the feat using its new “Intel 20A” node and RibbonFET transistors.
